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Thursday, 25 November 2021

sico smartphone mega flash file Cm2 Read Firmware

 



Reading Flash Content now ...

xGPT : Normalize settings Ok!

Brand     : alps
ProdName  : SSM-1-55-8M
ProdModel : SSM-1-55-8M
Device    : SSM-1-55-8M
AndroidVer: 6.0
MTKxCPU   : MT6737M
MTKxPRJ   : alps-mp-m0.mp1-V2.84_len6737m.35g.m0_P68

[Read Ok] : preloader_ww822_37m_35g_m0.bin
[Read Ok] : lk.bin
[Read Ok] : boot.img
[Read Ok] : recovery.img
[Read Ok] : logo.bin
[Read Ok] : secro.img
[Read Ok] : tz1.img
[Read Ok] : tz2.img
[Read Ok] : system.img
[Read Ok] : cache.img
[Read Ok] : userdata.img

[ScatCFG] : MT6737M / V1.1.2 / ww822_37m_35g_m0 / EMMC
Android Info saved
MAUI Meta DB saved
HWConfig Info saved
FW Size : 1516 MiB
Scatter saved to : C:\Users\GSM YOUSUF\Desktop\MT6737M__alps__SSM-1-55-8M__SSM-1-55-8M__6.0__alps-mp-m0.mp1-V2.84_len6737m.35g.m0_P68\

All done!

Done!
Elapsed: 00:05:32
Reconnect Power/Cable!





Thursday, 21 October 2021

OPPO A3S CPH1853 DUMP FIRMWARE FILE UFI BOX FULL DUMP FILE

  Init bus...

VCC: 3.3 V, VCCQ: 1.8 V

Bus: 1 bit (SDR 24MHz)

Access mode: sector mode

Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)

 Card/BGA: BGA (Discrete embedded) - High density MMC

 Manufacturer ID: 0x15 (Samsung)

 Product name: QE63MB (0x514536334d42), rev: 0x04, serial number: 0xE1D9AA4C

 Manufacturing date: Feb 2019

CID: 15010051 4536334D 4204E1D9 AA4C2660

CSD: D0270132 0F5903FF F6DBFFEF 8E40400C

EXT_CSD revision: 1.8 (MMC v5.1) 

Partition info:

 Boot1: 4096 KiB

 Boot2: 4096 KiB

 RPMB: 4096 KiB

 User area: 14.56 GiB(15,634,268,160 bytes)

CPH1853A3S



OPPO A3S CPH1803 DUMP FIRMWARE FILE UFI BOX FULL DUMP FILE

Connection status: XHCI:HUB3:[#0]:USB 2.00 High-Speed

Interface: UFI High-Speed

Serial number: 0011-8842-5443

 Boot version: 1.05, FW version: 1.13 (Aug 19 2019 23:46:09)

Insertion test... Done

Init bus...

VCC: 3.3 V, VCCQ: 1.8 V

Bus: 1 bit (SDR 4MHz)

Access mode: sector mode

Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)

 Card/BGA: BGA (Discrete embedded) - High density MMC

 Manufacturer ID: 0x15 (Samsung)

 Product name: QE63MB (0x514536334d42), rev: 0x03, serial number: 0x7D4D06ED

 Manufacturing date: Aug 2018

CID: 15010051 4536334D 42037D4D 06ED85C4

CSD: D0270132 0F5903FF F6DBFFEF 8E40400C

EXT_CSD revision: 1.8 (MMC v5.1) 

Partition info:

 Boot1: 4 MiB

 Boot2: 4 MiB

 RPMB: 4 MiB [Provisioned, counter: 176805]

 User area: 14.56 GiB(15,634,268,160 bytes)

Cache size: 64 MiB

Hardware reset function: 1

Partition configuration: 0x38

 No boot acknowledge is sent (default)

 User area is enabled for boot

Partitioning support: 0x07

 Device support partitioning feature

 Device can have enhanced technological features

 Device partitioning possible

Boot configuration protection: 0x00

Boot bus conditions: 0x00

Boot area write protection: 0x00

CPH1803

ANDROID System Info:

 platform: msm8953, cpu abi: arm64-v8a

 manufacturer: OPPO

 board: msm8953, name: CPH1803

 brand: OPPO, model: CPH1803 (OPPO A3s)

 build model list: CPH1803 (OPPO A3s)

 build id: OPM1.171019.026, version: 8.1.0 [Oreo] (CPH1803EX_11_A.34)

 build description: msm8953_64-user 8.1.0 OPM1.171019.026 eng.root.20210122.143520 release-keys


crypto state: encrypted?

Custom moviNAND command is not supported for this device(MMC51).

Selected: [SAMSUNG] KMQE60013M-B318/16GB+LPDDR3 16Gb   (BGA221)


 

OPPO A53 CPH 2137 DUMP FILE EMCP UFI BOX FULL FILE

Connection status: XHCI:HUB3:[#0]:USB 2.00 High-Speed

Interface: UFI High-Speed

Serial number: 0011-8842-5443

 Boot version: 1.05, FW version: 1.14 (Aug 25 2021 04:56:05)

Insertion test... Done

Init bus...

VCC: 3.3 V, VCCQ: 1.8 V

Bus: 1 bit (SDR 24MHz)

Access mode: sector mode

Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)

 Card/BGA: BGA (Discrete embedded) - High density MMC

 Manufacturer ID: 0x90 (SK Hynix)

 Product name: hB8aP (0x68423861503e), rev: 0x03, serial number: 0x328A84FB

 Manufacturing date: Mar 2020

CID: 90014A68 42386150 3E03328A 84FB37E2

CSD: D0270032 8F5903FF FFFFFFEF 8E400042

EXT_CSD revision: 1.8 (MMC v5.1) 

Partition info:

 Boot1: 4 MiB

 Boot2: 4 MiB

 RPMB: 16 MiB [Provisioned, counter: 7943]

 User area: 29.12 GiB(31,268,536,320 bytes)

Cache size: 2 MiB

Hardware reset function: 1

Partition configuration: 0x38

 No boot acknowledge is sent (default)

 User area is enabled for boot

Partitioning support: 0x07

 Device support partitioning feature

 Device can have enhanced technological features

 Device partitioning possible

Boot configuration protection: 0x00

Boot bus conditions: 0x00

Boot area write protection: 0x00

crypto state: encrypted?

eMMC selected: [HYNIX] H9TQ27ADFTMCUR/32GB  (BGA221)

cph2137


 

OPPO CPH2131 A53 DUMP FILE UFS 8GB EASY JTAG BOX


 


OPPOV AX7 CPH1903 DUMP FIRMWARE FILE UFI BOX

Bus: 1 bit (SDR 24MHz)

Access mode: sector mode

Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)

 Card/BGA: BGA (Discrete embedded) - High density MMC

 Manufacturer ID: 0x15 (Samsung)

 Product name: GP6BMB (0x475036424d42), rev: 0x01, serial number: 0x8761AC47

 Manufacturing date: Oct 2018

CID: 15010047 5036424D 42018761 AC47A5E8

CSD: D0270132 0F5903FF F6DBFFEF 8E40400C

EXT_CSD revision: 1.8 (MMC v5.1) 

Partition info:

 Boot1: 4096 KiB

 Boot2: 4096 KiB

 RPMB: 16384 KiB

 User area: 58.24 GiB(62,537,072,640 bytes)

Cache size: 64 MiB

Hardware reset function: 1

Partition configuration: 0x38

 No boot acknowledge is sent (default)

 User area is enabled for boot

Partitioning support: 0x07

 Device support partitioning feature

 Device can have enhanced technological features

 Device partitioning possible

Boot configuration protection: 0x00

Boot bus conditions: 0x00

Boot area write protection: 0x00

 Power-on write protection: possible

 Permanent write protection: possible

 Lock status: not locked

CPH1903

ANDROID System Info:

 platform: msm8953, cpu abi: arm64-v8a

 manufacturer: OPPO

 board: msm8953, name: CPH1903

 brand: OPPO, model: CPH1903 (OPPO AX7)

 build model list: CPH1903 (OPPO AX7)

 build id: OPM1.171019.026, version: 8.1.0 Oreo (CPH1903EX_11_A.26)

 build description: msm8953_64-user 8.1.0 OPM1.171019.026 eng.root.20201013.205032 release-keys


crypto state: encrypted?

Custom moviNAND command is not supported for this device(MMC51).

Detected: SAMSUNG moviNAND KMGP6000BM-BXXX/64G


 

Wednesday, 20 October 2021

CPH1823 DUMP FIRMWARE FILE UFI BOX

Init bus...

VCC: 3.3 V, VCCQ: 1.8 V

Bus: 1 bit (SDR 24MHz)

Access mode: sector mode

Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)

 Card/BGA: BGA (Discrete embedded) - High density MMC

 Manufacturer ID: 0x90 (SK Hynix)

 Product name: HCG8a4 (0x484347386134), rev: 0xA5, serial number: 0x09776034

 Manufacturing date: Jan 2018

CID: 90014A48 43473861 34A50977 60341550

CSD: D0270132 8F5903FF FFFFFFEF 8A400026

EXT_CSD revision: 1.8 (MMC v5.1) 

Partition info:

 Boot1: 4096 KiB

 Boot2: 4096 KiB

 RPMB: 4096 KiB

 User area: 58.24 GiB(62,537,072,640 bytes)

CPH1823


 

sico smartphone mega flash file Cm2 Read Firmware

  Reading Flash Content now ... xGPT : Normalize settings Ok! Brand     : alps ProdName  : SSM-1-55-8M ProdModel : SSM-1-55-8M Device    : S...